Yandex marked its birthday by allowing engineers to run its first AI earbuds, Yandex Drops, through a high-resolution X-ray microtomograph. The non-destructive scan produced two voxel datasets—one of the charging case with an earbud inside and one of a standalone earbud—capturing internal structures at 24.44 µm and 14.12 µm resolution respectively.
The earbuds contain an eight-layer HDI PCB with blind vias, a QFN-packaged central SoC approximately 2.8 × 2.0 mm that is presumed to house the NPU for always-on voice detection, and a smaller companion QFN die likely serving as memory or PMIC. A 4 × 4 BGA flash-memory candidate sits adjacent to the main processor.
Each earbud integrates three microphones: two external feedforward sensors positioned at the stem ports and one internal feedback microphone located roughly 5 mm from the driver diaphragm. Signal routing was traced from the MEMS elements through spring connectors and flex cables to the main board without any visible hardware switch or disconnect in the accessible layers.
The 11 mm dynamic driver and 46 mAh pouch cell were measured directly from the calibrated slices, matching the manufacturer’s specifications. The charging case houses a 520 mAh cell, USB-C receptacle, and a three-pin Hall-effect sensor on a flex tail that detects lid position; no shielded radio module was observed inside the case.
Capacitive touch electrodes are formed by stamped metalization on the inner surface of the stem, while a miniature SMD tactile switch on a daughter board provides physical button input. Charging contacts on the earbuds are spring-loaded claws that mate with corresponding pads inside the case.
All imaging was performed at the PRODIS facility using a 2 µm-resolution microtomograph; reconstruction and multi-volume analysis were carried out in the Russian-developed VolÅn software. The authors note that while the physical microphone traces appear continuous, any determination of what audio is actually transmitted requires separate RF traffic analysis.
