RAMP-C

Intel Unveils Starfire Chip Designed for AI Processing on US Military Satellites in Orbit

Intel has announced the Starfire system-on-chip, a radiation-tolerant processor developed specifically for orbital deployment aboard US government satellites. The chip integrates eight CPU cores, a three-die neural accelerator, and a graphics block using Foveros packaging, delivering up to 75 TOPS at 35 W. It combines Intel’s advanced 18A process for the CPU and AI blocks with the older Intel 3 node for the GPU, relying on architectural hardening rather than process maturity to withstand space radiation. Unlike legacy rad-hard processors such as BAE Systems’ RAD750, Starfire targets on-board AI inference and data processing instead of basic telemetry and control. The device remains a demonstration platform whose radiation performance is still under evaluation, with first test samples scheduled for the third quarter of 2026. Intel Government Technologies will handle distribution, and the project supports Pentagon programs RAMP-C and SHIP while Intel’s 18A yield roadmap extends into 2027.